The GE Fanuc DS200TCDAG1B Digital I/O Board offers precise control over industrial processes with its high-speed data transfer capabilities and robust design, ideal for applications requiring reliable data exchange.
Specification 1:Digital I/O Module
Specification 2:Mark V Series
Specification 3:Board Type: AG1B
Specification 4:Module Type: Digital I/O Board
Specification 5:Weight: 0.3 kg
Specification 6:Connector Compatibility: VME
Specification 7:Operating Temperature: -20°C to +60°C
Specification 8:Storage Temperature: -40°C to +70°C
The GE Fanuc DS200TCDAG1B Digital I/O Board is engineered for robust performance in harsh industrial environments. It features advanced signal processing technology that ensures accurate data transmission and reception, crucial for complex control applications.
With its compact design and lightweight construction, this board is easily integrated into various machinery and systems without compromising on functionality or performance. Its wide operating temperature range allows it to operate reliably across different climates, making it suitable for both indoor and outdoor installations.
Each channel is equipped with 50mA output capability, allowing for efficient power distribution to connected devices. The RS-485 interface supports long-distance communication, reducing the need for redundant cabling and minimizing installation costs.
Crafted from high-quality materials, the DS200TCDAG1B ensures durability and longevity, backed by industry-leading standards. It undergoes rigorous testing to meet stringent quality criteria, ensuring dependable operation in the most demanding conditions.
Easy-to-follow installation instructions and comprehensive documentation guide users through the setup process, enabling quick integration and minimizing downtime. This makes the DS200TCDAG1B an ideal choice for engineers and maintenance teams looking to upgrade or expand their industrial control systems.
The GE Fanuc DS200TCDAG1B Digital I/O Board offers precise control over industrial processes with its high-speed data transfer capabilities and robust design, ideal for applications requiring reliable data exchange.