KULICKE&SOFFA K&S AS-261-0-02 Semiconductor Assembly Station

Model Number:AS-261-0-02

Operating Range:200V to 240V

Power Consumption:2.5kW

Processing Speed:Up to 26,000 cph

Maximum Die Size:12×12 inches

Automation Level:Fully Automated

Software Compatibility:Windows 10 and above

    The K&S AS-261-0-02 is engineered with cutting-edge technology to deliver unparalleled precision in semiconductor assembly processes. Its compact design allows for efficient use on the factory floor, while its robust construction ensures reliability over long periods of operation.

    Featuring a sophisticated bonding mechanism, this tool is capable of handling intricate micro-bonding tasks with ease, making it an indispensable asset in semiconductor fabrication. It supports a wide range of workpiece sizes, from small components to larger assemblies, ensuring flexibility across various applications.

    With a process speed of up to 1200 parts per hour, the K&S AS-261-0-02 maximizes productivity without compromising on quality. Its adjustable bonding force range of 20 to 200gf ensures precise control over the assembly process, leading to superior connection strength and durability.

    Temperature control is critical in semiconductor bonding, and the K&S AS-261-0-02 excels in this area, maintaining a tight tolerance of ±0.1°C throughout the process. Coupled with an ultra-high vacuum level of 99.99%, it achieves exceptional purity in the bonding environment, minimizing contamination risks.

    Power efficiency is another highlight of this tool, consuming just 1500W while delivering high performance. This not only saves energy but also reduces operational costs significantly. Moreover, the ergonomic design ensures easy maintenance and hassle-free operation, contributing to a smoother workflow in the manufacturing environment.