The LAM ELECTROSTATIC CHUCK 839-800327-315 is a high-performance electrostatic chuck designed for semiconductor wafer processing. It ensures precise control over wafer position and pressure, facilitating efficient and accurate etching, deposition, and other critical fabrication processes.
Material:Premium grade stainless steel
Max Temperature Resistance:Up to 300°C
Vacuum Compatibility:Excellent, up to 1×10^-5 Torr
Electrostatic Force Range:Adjustable from 10N to 100N
Power Supply Voltage:24VDC
Control System Compatibility:Standard RS-232 interface
The LAM 839-800327-315 Electrostatic Chuck is engineered for optimal performance in the most demanding semiconductor fabrication environments. Its advanced electrostatic force technology ensures precise and consistent hold on materials, enhancing process efficiency and yield.
Crafted from high-grade stainless steel, this chuck is robust yet lightweight, providing durability and ease of handling during installation and maintenance.
Operating within an expansive temperature range from -40°C to +200°C, it maintains its effectiveness across various manufacturing processes, making it suitable for a wide array of applications in the semiconductor industry.
Designed for seamless integration with all standard industrial vacuum systems, the LAM 839-800327-315 Electrostatic Chuck simplifies setup and reduces downtime, ensuring continuous production flow.
With dimensions measuring 150mm x 150mm x 50mm and a manageable weight of approximately 5kg, it offers flexibility in space constraints and is easily transportable between different manufacturing stations.
The LAM ELECTROSTATIC CHUCK 839-800327-315 is a high-performance electrostatic chuck designed for semiconductor wafer processing. It ensures precise control over wafer position and pressure, facilitating efficient and accurate etching, deposition, and other critical fabrication processes.